Valydate is mentioned in the AdvancedTCA Newsletter 2012 of where Lance Leventhal discusses Navigating the Technology Minefield. You can read the article here.
Valydate News Blog
Valydate in ACTA Newsletter2012
Minister of State Visits Valydate Inc.
| March 28th, 2012 |
On Tuesday, March 27, the Honourable Gary Goodyear, Minister of State for Science and Technology, visited Valydate Inc. to congratulate the company's success.
One of the many key ingredients to the success of Valydate Inc. is the National Research Council's Industrial Research Assistance Program, which is more commonly referred to as IRAP. This program was valuable to Valydate, in helping to build the company's business plan as well as providing connections to vital industry contacts.
NRC-IRAP is part of the government's innovation plan within Economic Action Plan 2012 to stimulate economic growth through innovation within small and medium sized enterprises in Canada, as highlighted by the Honourable Gary Goodyear.
For The Honorable Gary Goodyear's speech visit: http://www.ic.gc.ca/eic/site/ic1.nsf/eng/07120.html
Official Press Release: http://prlog.org/11836046
Valydate wins DesignVision Award at DesignCon 2012
| Feburary 8th, 2012 |
Valydate was recently recognized at Santa Clara's DesignCon 2012 in the category of Design Verification Tools! Valydate won the DesignVision Award in this category. More info about this can be found here
Valydate wins New Business of the Year at the OBAA Gala
| December 2, 2011 |
Valydate was recently recognized at the Ottawa Business Achievement Awards Gala in the catagory of New Business of the Year! Valydate won Bronze in this category. More info about this can be found here.


3 PCB Power Integrity Concerns and How to Solve Them
| September 7th, 2011 |
Detailed attention to Power Integrity is a requirement for today's complex electronic designs. Poor stack-up design, low voltage, split planes, and mis-used de-coupling caps all lead to Power Integrity problems.
Optimized performance and long-term reliability can be achieved when analysis supports key decisions such as stack-up design, power plane design, de-coupling cap use, and materials selections. 3 key areas of PCB Power Integrity concern can be found here, with indications of how Power Integrity Analysis directly supports these critical decisions.
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